Erin Mills Town Centre Gift Cards are the perfect choice for your gift giving needs.Purchase gift cards at kiosks near the food court or centre court, at Guest Services, or click below to purchase online.PURCHASE HERE
Indigo Advanced Interconnects for ULSI Technology | Erin Mills Town Centre
*Product information may vary - to confirm product availability, pricing, shipping and return information please contact Indigo
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: *Interconnect functions, characterisations, electrical properties and wiring requirements *Low-k materials: fundamentals, advances and mechanical properties *Conductive layers and barriers *Integration and reliability including mechanical reliability, electromigration and electrical breakdown *New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: *Interconnect functions, characterisations, electrical properties and wiring requirements *Low-k materials: fundamentals, advances and mechanical properties *Conductive layers and barriers *Integration and reliability including mechanical reliability, electromigration and electrical breakdown *New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
The largest book retailer in Canada also offers toys, music, home décor, gifts and lifestyle products. What's Inside...Books, Magazines, CD’s and DVD’s, Toys and Gifts, Home Accents, Electronics, Baby’s and Children’s Section, Bath and Body, Kitchen and Bedroom, Stationary Located outside in the exterior plaza.
