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Indigo Micro-Joining of Materials: Current and Future Needs | Erin Mills Town Centre
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This book addresses primary and secondary procedures for combining sophisticated materials such as metals and alloys, intermetallic, ceramics, glasses, polymers, superalloys, electronic materials, and composites in similar and dissimilar combinations, based on the most recent research. It further explores the current and future micro-joining techniques that are rapidly expanding, including delicately and precisely combining microscale components and materials. It offers a detailed reference to the status of micro-joining and potential future possibilities.
Provides an understanding of micro-joining techniques with a focus on its various applications such as in biomedical, electrical and electronics, and aerospace
Covers specialized techniques such as micro-electronics wire bonding, solid-state diffusion bonding, diffusion soldering, laser soldering, and laser micro-welding
Details analytical and numerical modeling of micro-welding processes with their optimization
Describes complete mechanism of joining of various parts/components
Includes case studies with present day daily life applications
This book is aimed at researchers and graduate students in materials science and microfabrication.
This book addresses primary and secondary procedures for combining sophisticated materials such as metals and alloys, intermetallic, ceramics, glasses, polymers, superalloys, electronic materials, and composites in similar and dissimilar combinations, based on the most recent research. It further explores the current and future micro-joining techniques that are rapidly expanding, including delicately and precisely combining microscale components and materials. It offers a detailed reference to the status of micro-joining and potential future possibilities.
Provides an understanding of micro-joining techniques with a focus on its various applications such as in biomedical, electrical and electronics, and aerospace
Covers specialized techniques such as micro-electronics wire bonding, solid-state diffusion bonding, diffusion soldering, laser soldering, and laser micro-welding
Details analytical and numerical modeling of micro-welding processes with their optimization
Describes complete mechanism of joining of various parts/components
Includes case studies with present day daily life applications
This book is aimed at researchers and graduate students in materials science and microfabrication.
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